Qualcomm announced two major connectivity solutions aimed at powering next-generation smartphones and connected devices at the Mobile World Congress (MWC) 2026 on Monday. The new platforms, dubbed Qualcomm FastConnect 8800 Mobile Connectivity System and the Qualcomm X105 5G Modem-RF System, focus on Wi-Fi 8, Bluetooth 7, proximity-based AI experiences, and AI-powered 5G Advanced connectivity. Alongside, the chipmaker also announced the Snapdragon Wear Elite platform, bringing agentic AI capabilities for future wearable devices.

Qualcomm FastConnect 8800 Mobile Connectivity System

Qualcomm FastConnect 8800 has been designed as an integrated mobile connectivity solution that includes Wi-Fi 8, Bluetooth 7, Ultra Wideband, and Thread, all integrated into a single chip based on the 6nm process. According to Qualcomm, the FastConnect 8800 has a 4x4 radio architecture and can achieve Wi-Fi speeds up to 11.6Gbps.